Investigation of Cyanoacrylate Adhesive Bond Curing and Durability using Electrochemical Impedance Spectroscopy

Electrochemical Impedance Spectroscopy (EIS) and other techniques will be employed to better understand the mechanisms of adhesive curing and bonding. EIS can detect ionic movement, adsorption processes and charge storage occurring at an adhesive/substrate interface and/or in a bulk bond-line during the curing (polymerisation) process. As a result adhesive formulations with enhanced service properties can be developed. Investigation of thermal degradation of bonds at the adhesive/ substrate interface at temperatures well below those required for degradation of the bulk bond-line adhesive and hydrolytic bond failure will also be carried out.
A range of adhesives will be studied including cyanoacrylate (CA) (Superglue) and other anaerobic acrylates. Polymerisation is often triggered by traces of basic substances at the adhesive/substrate interface, resulting in rapid formation of large molecular weight polymers. However increasing the bond gap from 10 microns (“zero gap bond”) to 100 microns can increase bond fixture time from a few seconds up to several minutes, sometimes limiting their service capabilities.
Insights gained from better understanding of the curing process will be of potential benefit to Henkel (Ireland) Ltd and assist the development of advanced adhesive formulations for possible use in new applications. In addition the project is of significant academic/ scientific value, further extending use of the powerful EIS technique, which is increasingly being employed in a range of new fields.

For further information on the project please see http://www.dit.ie/researchandenterprise/graduateresearchschool/phdopportunities/phdprojects/scienceshealth/

To make an application, please complete the application form online available at

www.dit.ie/phd