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packaging PhD Projects, Programs & Scholarships

We have 21 packaging PhD Projects, Programs & Scholarships

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  Finite Element Modelling for Optimisation of Renewable packaging
  Dr G Menary
Applications accepted all year round
This project aims at developing fundamental knowledge of the processing behaviour for a new bio sourced polymer that will transform the packaging industry (an industry worth 57 billion) by replacing petroleum based PET containers for the carbonated soft drink (CSD) and water industries.
  Development of Novel Functional Intermediate Layers for Power Electronics Integration - Ref: CL2UF2018
  Prof C Liu
Applications accepted all year round
Power electronics are widely used in electric and hybrid vehicles (EHV), aerospace crafts, renewable power components and traction control systems.
  Doctor of Engineering (EngD): Development of Optoelectronic Sensor Systems to Support Materials Life Assessment (AWE)
  Prof D Reid
Application Deadline: 28 February 2019
The EngD is an alternative to a traditional PhD aimed at students wanting a career in industry. Students spend about 75% of their time working directly with a company in addition to receiving advanced-level training from a broad portfolio of technical and business courses.
  Doctor of Engineering (EngD): Miniaturised high-reliability lasers for Quantum Technologies (Optocap)
  Prof D Reid
Applications accepted all year round
Project not available to non UK/EU applicants. The EngD is an alternative to a traditional PhD aimed at students wanting a career in industry.
  Laser machining of ceramics for medical ultrasound applications
  Prof D P Hand
Application Deadline: 8 February 2019
This project will focus on the ultrashort pulsed laser singulation of complex 3D ultrasound arrays for medical device applications, in collaboration with the University of Glasgow and other partners.
  Advanced manufacturing processes to enable the heterogeneous integration of power electronics - Ref: CL1UF2018
  Prof C Liu
Applications accepted all year round
Heterogeneous integration of power devices refers to the assembly of separately manufactured power semiconductors, passive components and control elements into a single package, i.e.
  Mechanical Characterisation of Poly-Lactic Acid (PLA) bioplastic from Biomass and its digestibility in a Thermophilic anaerobic digestion (AD) process.
  Dr S Tedesco
Applications accepted all year round
Reference Number. AMRC-ST-2018-1-PhD. Project Summary. The research focuses on testing bioplastic PLA for applications within the packaging industry.
  Multiphysics Characterisation of 0.15 μm InGaAs pHEMT Low-Noise Device for 5G Communication Applications
  Dr S Ekpo
Applications accepted all year round
Reference Number. I4.0Com-SE-2018-1-PhD. Project Summary. Global research interests to satisfy the stringent requirements of the emerging 5G radio access technology (RAT) are increasing.
  Multiphysics Characterisation of 0.25 μm GaN/SiC HEMT Power Device for 5G Communication Applications
  Dr S Ekpo
Applications accepted all year round
Reference Number. I4.0Com-SE-2018-2-PhD. Project Summary. Global research interests to satisfy the stringent requirements of the emerging 5G radio access technology (RAT) are increasing.
  A soft robotic technology by controllably morphing gel structures (Advert Reference: SF18/MCE/XU)
  Dr B Xu
Applications accepted all year round
This project includes the design and fabrication of a soft robotic technology by using the stimuli-responsive hydrogel materials and structural thin shell design, which enable instability morphology to be spatially distributed and generated at the surface of gel structure.
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