3D printable THz waveguides for on-chip applications

Driven by our data hungry society, chip-to-chip and device-to-device data bit rates will need to reach terabits per second in a not distant future. Such data rate will only be met if there is a shift from microwaves to mm-waves (ca. 30 – 300 GHz) or even Terahertz frequencies (ca. 0.3 – 1 THz). Current on-chip interconnect technology relies on printed circuit board (PCB), which is not suitable for high frequencies due to loss and dispersion limitations. Tackling these problems with complex equalization techniques will not be possible because of their high power consumption and needed area.

To address the need for high-speed links for THz interconnects, this project will focus on the topological optimisation of the promising dielectric-lined metallic waveguide. The recent fabrication flexibility enable by two-photon polymerisation 3D printing rationalizes the use of the powerful topological optimisation.

We expect the PhD candidate to develop the expertise required to lead an experimental research project, to train students, to interact with colleagues with different backgrounds (physics and engineering) and from different disciplines (i.e., electromagnetism, RF communications, material science). Details of the project will be agreed with the interested candidates to tailor the research on his/her interests. 

The research programme will take place in an international and interdisciplinary environment, which will substantially favour collaborative opportunities.