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Additive Manufacturing of Novel Metal Microwave Components for Space Applications - An EPSRC iCase Project with Renishaw Plc. UK

  • Full or part time
    Prof Jiasheng Hong
  • Application Deadline
    Applications accepted all year round
  • Funded PhD Project (European/UK Students Only)
    Funded PhD Project (European/UK Students Only)

Project Description

RF/microwave components are essential for telecommunications and radar systems. With on-going development of 5G mobile networks and new generations of satellite platforms, which are the backbone of many emerging applications such as Internet-of-Things (IoT) and Internet-of-Space (IoS), metal 3D printing or additive manufacturing has recently been seen as an enabling technology for future RF/microwave components to meet stringent requirements for system applications.

Additive manufacturing (AM) is revolutionising how RF/microwave components are designed and manufactured. This all presents a great opportunity and potentially large market of using and commercializing metal 3D printing technology in this field. This industrially collaborative PhD will provide students with the opportunity to interact with researchers and developers from both academic and industry sectors. It is expected that the candidate will work on industry inspired problems and challenges. The project will involve electromagnetic simulation and design of metal 3D RF/microwave components, prototype hardware manufacturing and experimental demonstration.

The project industrial partner Renishaw is one of the world’s leading engineering and scientific technology companies, with expertise in precision measurement and healthcare. The company supplies products and services used in applications as diverse as jet engine and wind turbine manufacture, through to dentistry and brain surgery. It is also a world leader in the field of additive manufacturing (also referred to as metal 3D printing), where it is the only UK business that designs and makes industrial machines which ‘print’ parts from metal powder. For this project, the company will also offer Additive Manufacturing of prototype on their machines; their commitment of appropriate human resource and use of their ancillary equipment to support research; and a member of staff to be an industrial supervisor and liaison.This project will further strengthen the Strategic Alliance between Renishaw and Heriot-Watt.

Applicants should have or expect to achieve at least a 2.1 honours degree in Electrical, Electronic or Mechanical Engineering, Physics, or related disciplines.

The successful candidate will join a research project team, led by Prof. Jiasheng (Jason) Hong, IEEE Fellow, based in the Institute of Sensors, Signals and Systems (ISSS). ISSS is a dynamic, multidisciplinary research Institute focused on promoting excellence across its main research themes. Much of our work involves strong industrial links across a range of sectors and through our expertise, skills and experience we work together with industry to identify new areas of interest.

If you are interested in this position, please contact Prof. Jiasheng Hong for further information,

Expected start date: From October 2019 or upon mutual agreement.

Funding Notes

EPSRC iCase Studentship with Renishaw Plc. This is available for Home and EU applicants who have lived, worked or studied within the UK for three years prior to the start date. The studentship is for 4 years and covers University tuition fees (Home/EU) and provides an annual tax-free stipend of minimum £17,000 (increasing each year).


[1] IET Microwaves, Antennas&Propagation, “Microwave components using AM techniques”, vol.11(14), 2017.
[2] Sorrentino R. and Peverini O.A., “Additive manufacturing: A key enabling technology for next generation microwave and millimeter-wave systems,” Proceedings of the IEEE, vol. 104, pp. 1362–1366, 2016.
[3] Booth P. and Lluch E.V., “Enhancing the Performance of Waveguide Filters Using Additive Manufacturing”, Proceedings of the IEEE, vol. 105, pp. 613-619, 2017.
[4] Zhang B. and Zirath H.,“Metallic 3D printed rectangular waveguides for millimeter-wave applications,” IEEE Trans. on Components, Packaging and Manufacturing Technology, vol. 6, pp. 796–804, 2016.

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