About the Project
Heterogeneous integration of power devices refers to the assembly of separately manufactured power semiconductors, passive components and control elements into a single package, i.e. System in Package (SiP) that, in the aggregate, provides increased functionality, enhanced reliability and reduced cost. The integration of the next generation wide-band gap (WBG) power devices has, nevertheless, been bottlenecked by prevailing manufacturing technologies, which are unlikely to offer a cost-effective way of implementing the necessary 3D structures needed to contain the electromagnetic interference (EMI), address the thermal integration issues and offer a more robust and reliable packaging solution.
This PhD project will focus on the development of novel structural embedding methodology and 3D multi-material architecture, using various processing methods such as subtractive lithography, additive manufacturing, patterned deposition (e.g. electrolytic and electroless plating) and precision micro-machining, and with emphasis on the thermal and electrical reliability of the integration system. Successful candidates will join an interdisciplinary team with substantial industrial exposure and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future high value added hybrid electronics.
Applicants should have, or expect to achieve, at least a 2:1 Honours degree (or equivalent) in materials science, engineering, chemistry, physics or a related subject.
A relevant Master’s degree and/or experience in one or more of the following will be an advantage: electronics manufacturing, materials characterisation, electrochemical processes, and surface coating technologies. Previous research experience in at least one of these research areas is desirable, especially those who has had track record of publications in their respective field.
How to apply
All applications should be made online. Under programme name select Mechanical and Manufacturing Engineering. Please quote reference number: CL1UF2018
Various start dates available: 01 October, 01 January, 01 April, 01 July
2019 fees – UK/EU: £TBC, International: £21,100