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Advanced Reliability Modelling for Electronic Components and Assemblies

   Faculty of Liberal Arts & Sciences

This project is no longer listed on and may not be available.

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  Prof Chris Bailey, Dr Stoyan Stoyanov  No more applications being accepted  Funded PhD Project (Students Worldwide)

About the Project

The successful applicant will work on a fully funded PhD programme aimed to research and develop advanced predictive engineering models for reliability assessment of electronic components and assemblies. This PhD position is with the Computational Mechanics and Reliability Group at the University of Greenwich, comprising a multi-disciplinary team focused on developing cutting-edge design, modelling and simulation technologies for the electronics industry and supported through numerous UK-Government, Industry , and International Grants. 

Electronic chips (semiconductors such as silicon, silicon carbide, gallium nitride, etc) are used in electronic products ranging from smart mobile phones, digital infrastructure (Internet of Things), electric transport to renewable energy. The electronics industry is the world’s largest industrial sector, and these  chips are packaged into components using materials such as plastics and ceramics to protect the chip from environment conditions such as temperature, moisture, and vibration, and to enable assembly-level integration. But mechanical and thermo-mechanical loads cause degradation and different stress-induced failures of these multi-material electronic packages.

Working with our industrial partners, this PhD project will focus on the development of modelling methodologies and methods for simulating the thermo-mechanical behaviour of advanced semiconductor packages and predicting the associated stress-induced electronic material degradation and damage.  The programme will target the research and development of methods for fast multi-scale finite element analysis of packaged semiconductors using tools such ANSYS. The developed modelling capabilities will support the virtual design and optimisation of these electronics packages and higher-level electronic systems at the early stages of product development and will enable up-front evaluation of the reliability performance and lifetime. The successful candidate will gain multi-disciplinary knowledge, skills and experience in reliability engineering, finite element modelling and analysis, and numerical techniques for optimisation. Support will be provided to disseminate the research outputs at international IEEE conferences and publish in high impact factor journals.


For further information please contact:

Professor Chris Bailey ([Email Address Removed])  and  Dr Stoyanov ([Email Address Removed])

Bursary available (subject to satisfactory performance):

Year 1: £15,285                Year 2: In line with RCUK rate        Year 3: In line with RCUK rate

The successful candidate will receive a contribution to tuition fees equivalent to the university’s Home rate, currently £4,407, for the duration of their scholarship. International applicants will need to pay the remainder tuition fee for the duration of their scholarship. This fee is subject to an annual increase. Scholarships are available for three years, full-time study from the date scholars first register as an MPhil/PhD student with the university. Applicants must meet the programme entry requirements. 

For additional information about the scholarship please go to:

Please read this information before making an application. Applications need to be made online via No other form of application will be considered.

All applications must include the following information. Applications not containing these documents will not be considered.

•       Scholarship Reference Number (Ref) – included in the personal statement section together with your personal statement as to why you are applying

•       a research proposal *

•       a CV including 2 referees *

•       academic qualification certificates/transcripts and IELTs/English Language certificate if you are an international applicant or if English is not your first language or you are from a country where English is not the majority spoken language as defined by the UK Border Agency *

*upload to the qualification section of the application form. Attachments need to be in PDF format.

The closing date for applications is midnight (UTC) on 10th May 2021

The scholarship must commence before 1st September 2021.

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