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Chip-Level Wireless Power Transfer for System-on-Chip Applications

   Department of Electrical Engineering and Electronics

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  Dr J Zhou, Prof T-J Yen  No more applications being accepted  Funded PhD Project (Students Worldwide)

About the Project

The deadline for this opportunity is 31/05/2021, however the position will close earlier if a suitable candidate is recruited.

This project is part of a 4 year Dual PhD degree programme between the National Tsing Hua University (NTHU) in Taiwan and the University of Liverpool in England. As Part of the NTHU-UoL Dual PhD Award students are in the unique position of being able to gain 2 PhD awards at the end of their degree from two internationally recognised world leading Universities. As well as benefiting from a rich cultural experience, Students can draw on large scale national facilities of both countries and create a worldwide network of contacts across 2 continents.

The aim of this joint PhD project is to develop chip-level wireless power transfer techniques to power integrated circuits.

Wafer-level testing is an essential process for semiconductor device fabrication. Traditional wafer testing techniques utilize either a probe station or a probe card. When using a probe station, both DC and radio frequency probes are needed to handle DC power and any input/output signals to a device under test.

In this PhD project, sub-THz wireless power transfer techniques will be developed to provide DC power for integrated circuits. A power transmitter will be embedded on a printed circuit board to power integrated circuits wirelessly. An integrated circuit chip based on this technique will only need to be loosely attached to the printed circuit board to receive power. The chip can be measured or operated without the requirement of a DC connection or indeed any wired connections with other devices. It will significantly reduce the complexity of integrated circuit packaging, and greatly improve the flexibility and reliability of integrated circuit measurement and operation.

The candidates are expected to have:



BSc (first class or upper second)/MSc/MPhil in Electronics Engineering, Computer Science, Mathematics, Physics or a related subject.

Strong theoretical and applied knowledge in radio frequency devices, integrated circuit design, wireless power transfer or energy harvesting.



Ability and experience of radio frequency circuit design.

Experience on wireless communications systems.

Experience of writing academic papers or reports.

International applicants are welcome. Candidates who are interested are encouraged to make contact and apply at their first convenience, since the position will be closed once a suitable candidate is recruited.

For academic enquires please contact Dr. Jiafeng Zhou ([Email Address Removed]) & Prof. Ta-Jen Yen ([Email Address Removed])

For enquires on the application process or to find out more about the Dual programme please contact [Email Address Removed]

To apply for this position please visit: When applying please ensure you Quote the supervisor & project title you wish to apply for and note ‘NTHU-UoL Dual Scholarship’ when asked for details of how plan to finance your studies.

Funding Notes

It is planned that students will spend 2 years at the University of Liverpool, followed by 2 years at NTHU. Both the University of Liverpool and NTHU have agreed to waive the tuition fees for the duration of the project and stipend of TWD 11,000/month will be provided as a contribution to living costs (the equivalent of £280 per month when in Liverpool).

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