Power electronics are widely used in electric and hybrid vehicles (EHV), aerospace crafts, renewable power components and traction control systems. At present, the rapid development in construction of power modules which is somewhat restricted by high switching frequency, high reliability and low loss requires heterogeneous integration. The uses of Wide Band Gap (WBG) such as SiC devices are also limited by the packaging technologies. This demands a cost effective route of implementing the necessary 3D structures needed to contain the EMI, address the thermal management and offer a more robust and reliable packaging solution. This PhD project will focus on the packaging and integration technologies through the use of functional intermediate layers to enhance electrical, thermal and mechanical performance enabling a timely need to make a leap forward for the future use of these devices. This will be achieved by the development of different functional inter-layers and heterogeneous integration to enable robust multi-material, multi-functional embedded structures. Numerical modelling as well as materials characterisation techniques will be utilised to qualify the functionalised surfaces as well as the resultant interfaces in the course of interaction and evolution of the integrated structures. Successful candidates will join an interdisciplinary team with substantial industrial engagement and academic collaborations in the UK and worldwide, as such they will be able to continue their career in this exiting field delivering future enabling technologies for wide range of power electronics devices.
Applicants should have, or expect to achieve, at least a 2:1 Honours degree (or equivalent) in materials science, engineering, chemistry, physics or a related subject.
A relevant Master’s degree and/or experience in one or more of the following will be an advantage: electronics interconnects and testing (e.g. under multi-parametric coupled loadings including stress/strain, thermo-, electro- or magnetic), materials deposition/bonding and interfacial characterisation, preferably with skills and previous experience of numerical modelling using advanced software packages, especially those who has had track record of publications in their respective field.
How to apply
All applications should be made online. Under programme name select Mechanical and Manufacturing Engineering. Please quote reference number: CL2UF2018
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