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  Formulation of Resist Materials with Dendrimers and Metal-Organic Precursors


   Department of Chemistry

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  Prof R Winpenny, Prof S Yeates  No more applications being accepted  Funded PhD Project (European/UK Students Only)

About the Project

More conventionally, EBL is used to write patterns into resist materials that are then developed and etched. Conventional resist materials are polymers such as PMMA, but recently we have developed metal-organic resists that show very exciting properties. This half of the project would be to combine polymer-based resists with metal-organic resists, and study the resulting properties. The project would involve synthesis of the metal-organic precursors and formulation of the new resists with novel polymers developed in the Yeates group. We would then study the properties by EBL. The project would offer training in a wide range of skills and techniques and involve collaboration with other leading UK groups.

Applicants are expected to hold, or about to obtain, a first class or 2:i degree (or equivalent) in Chemistry or an appropriate related discipline.

Contact for further Information:
Professor Winpenny
[Email Address Removed]

Funding Notes

This is a 3.5 year funded studentship covering fees and stipend(£15,009 p.a. in 2019/20).

Open to UK/EU nationals only. Please note, EU students need to have 3 years residency in the UK to be eligible, due to funding restrictions.

We expect the programme to start in September 2020.

References

• S. M. Lewis, M. S. Hunt, G. A. DeRose, H. R. Alty, J. Li, A. Wertheim, L. De Rose, G. A. Timco, A. Scherer, S. G. Yeates and R. E. P. Winpenny, “Plasma-etched pattern transfer of sub-10 nm structures using a metal-organic resist and helium ion beam lithography”, Nano Lett., 2019, 19, 6043-6048.

• S. M. Lewis, A. Fernandez, G. A. DeRose, M. S. Hunt, G. F. S. Whitehead, A. Lagzda, H. R. Alty, J. Ferrando-Soria, S. Varey, A. K. Kostopoulos, F. Schedin, C. A. Muryn, G. A. Timco, A. Scherer, S. G. Yeates and R. E. P. Winpenny, “Use of Supramolecular Assemblies as Lithographic Resists”. Angew. Chem. Int. Ed. 2017, 56, 6749-6751.

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