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Fully Funded M2A EngD Scholarship: Interactive Steel Packaging for Brand Protection and Enhanced Consumer Experience

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  • Full or part time
    Dr E H Jewell
  • Application Deadline
    No more applications being accepted
  • Funded PhD Project (European/UK Students Only)
    Funded PhD Project (European/UK Students Only)

Project Description

Start date: October 2019

Supervisor: Dr E Jewell, Dr D Degenello and Mr R O’Neill

Sponsoring company: Tinmasters

Steel packaging is the product of choice for many manufacturers, where quality, integrity and brand status are key.

A highly prized market is global packaging of infant baby formula, which currently has a value of $18Bn in China alone. European brands are held in the highest esteem and command the most market share. Counterfeit material is known to enter the market, sometimes with fatal consequences. Currently, brand protection is applied to steel packaging through covert and overt features during the decorating stage to help ensure product integrity. There is scope for further innovation through the development of interactive packaging using technology such as near field communications, radio frequency identification, quick response codes, electronic sensors and internet of things integration. These provide additional product security, enhance the customer experience, monitor product tampering and provide customer feedback to the brand owner.

Tinmasters provide highest quality steel packaging for leading international brand owners in food, beverage and premium goods. Tinmasters have a pedigree in innovation with ability to identify future customer demands and provide unique technological inspired solutions. The development of interactive packaging is the next logical step in their product and service portfolio.

This project offers the opportunity for an enthusiastic and free-thinking researcher to develop innovative solutions to important commercial and human health issues. There are a multitude of possible research avenues including device design, device testing, device modelling, engineering integration, life cycle analysis, economic analysis, software integration, durability and whole system analysis.

Eligibility
We welcome applications from candidates with an Engineering or Physical Science degree (minimum level 2:1), or a combination of degree and equivalent relevant experience to the same level, to join the M2A community of research engineers.

Please visit our website for more information on eligibility.

Funding Notes

The scholarship covers the full cost of UK/EU tuition fees, plus a tax free stipend of £20,000 p.a. for a period of four years.

Related Subjects



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