Multi-fidelity Modelling of Electronics Cooling

Electronics cooling is critical to the reliable performance of a vast array of todays technologies including datacentres, electric vehicles, avionics, telecommunications to name only a few. Pertinent to this is the accurate prediction of fluid flow and heat transfer. Analyses range from below chip to data centre levels, requiring multi-fidelity Computational Fluid Dynamics (CFD) methods. Suitable methods based around Large-Eddy Simulation (LES) and immersed boundary methods (IBMs), with wide application will be developed. Suitable candidates would have a degree in Mechanical or Aerospace Engineering, or Mathematical modelling related subjects. Simulations and data analysis will utilise efficient parallel computations on CPUs and GPUs on High Performance Computing (HPC) facilities.