Next generation additive manufacturing (3D printing) using semiconductor laser arrays for ultimate control of part properties

Research into next-generation additive manufacturing processes based on a new method for selective laser melting. The approach, pioneered in Sheffield, uses dense arrays of semiconductor lasers at wavelengths matching the peak absorption of the material being processed. This efficient, scalable, high-speed parallel processing of powdered feedstock benefits from precise control over material microstructure and offers improved part functionality in a wide range of applications.

The successful applicant will have the opportunity to gain expertise in a range of associated themes including the design and customisation of integrated optical systems, materials processing, in-situ process monitoring and control system optimisation as well as microstructural characterisation of your 3D printed parts. The Studentship will be based primarily within the Dept. of Electronic & Electrical Engineering, but will work in partnership with colleagues across the Engineering Faculty (Mechanical Engineering and Materials Science), further broadening their skill-set. The instrument uses mainly off-the-shelf components for printing metallic parts but it will also be possible to engage in semiconductor laser development for extension of the technology into the mid-IR for polymer parts, using our own extensive facilities for epitaxial growth, device fabrication and characterisation.

Apply online at https://www.sheffield.ac.uk/eee/pgr/apply