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Towards heterogeneous integration of photonic and electronic devices in microsystems


Project Description

A funded PhD Studentship (UK/EU only) is available for research into III-V compound semiconductor structures tailored specifically for integration within a micro-transfer print process for heterogeneous integration of photonic and electronic devices in microsystems.

The Studentship will be underpinned by a newly-funded EPSRC Programme Grant “Hetero-Print”, which aims to develop a scalable manufacturing technology for heterogeneous integration of photonic and electronic devices based around a micro-transfer print process. The project will utilise novel programmable elastomer stamps to print a range of devices such as lasers, LEDs, detectors and quantum circuits. By creating a new generation of integrated functional electronics the research will lead to exciting new innovations in robotics, displays, photonic integrated circuits, sensors for healthcare, and quantum information processors.

Research will be based within the Semiconductor Materials & Devices Group in The Department of Electronic & Electrical Engineering and the successful applicant will also work closely with colleagues in the Department of Physics, the EPSRC National Epitaxy Facility (www.nationalepitaxyfacility.co.uk), project partners at the Universities of Glasgow, Strathclyde, Cambridge and Manchester and with associated industrial collaborators. The Department of Electronic & Electrical Engineering is currently host to the EPSRC National Epitaxy Facility , a world-class facility for the growth of a range of semiconductor materials. In addition, the team has access to a state-of-the-art device fabrication cleanroom facility and an extensive range of optoelectronic characterisation facilities.

The research programme will focus on the development of III-V compound semiconductor structures tailored specifically for integration within the micro-transfer print process and will encompass: the design of new photonic device structures for integration, development of novel sacrificial layers and etch chemistry for device lift-off, strain engineering of thin semiconductor membranes, and the development of fabrication and test capability to create systems demonstrators using the transfer print technology. The successful applicant will therefore gain expertise in the art of optoelectronic component and integrated system design, advanced device fabrication technologies, and a range of material and device characterisation techniques.

The Studentship will be best suited to candidates with a keen interest in semiconductor device fabrication and characterization techniques, and a solid background in semiconductor photonics.

Apply online at https://www.sheffield.ac.uk/eee/pgr/apply

Funding Notes

Funding is available for UK and EU students only. Awards for UK students cover 100% of tuition fees plus a maintenance allowance (the current RCUK standard stipend is £14,777 per annum). EU applicants who have been resident in the UK for at least 3 years immediately preceding the start of their course are eligible for awards that cover tuition fees and provide a maintenance allowance. EU applicants that do not meet this residency criteria are eligible for a fees-only award. Self-funded overseas applicants are also welcome.

How good is research at University of Sheffield in Electrical and Electronic Engineering, Metallurgy and Materials?
Electronic and Electrical Engineering

FTE Category A staff submitted: 34.80

Research output data provided by the Research Excellence Framework (REF)

Click here to see the results for all UK universities

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