About the Project
The School of Engineering at the University of Glasgow is seeking a highly motivated graduate to undertake an exciting 3.5 year PhD project “Ultra-thin Bendable Microsystems for Biomedical Applications”
Dr Ravinder Dahiya and Prof David Cumming
Most people are impressed if not amazed at the fantastic progress in the biomedical field, which barely existed fifty years ago. There have been giant leaps in not just the manner in which technology is being used, to treat patients, but also the way the electronics and sensors have diffused in to society and resulted in paradigm shifts in health monitoring. Electronic microsystems can now be ingested (e.g. swallowable capsules, lab-on-pill etc.) to explore the gastrointestinal tract and can transmit the acquired information to a base station. The march of electronic technologies on the lines of “More than Moore” and bendable/flexible electronics will further forge the synergy between electronics and biology and we could see more exciting opportunities in near future. For example, we may see new ways of recording neural signals or brain/machine interfaces if the implanted electronics could become ultra-thin, bendable and stretchable and thus integrate intimately with the soft, curvilinear surfaces of biological tissues. This project is about this key enabler i.e. ultra-thin bendable electronics, which we believe will lead to further convergence of biology and electronics. Using standard mico/nanofabrication technology as a platform, this project will develop bendable and conformable microsystems with sensors as well as electronics on the ultra-thin chips. The sensors based on piezoelectric materials such as AlN will be fabricated on ultra-thin Si chips and will form an important part of implantable systems. There are considerable challenges to be overcome to make such technology possible.
The student will receive training in advanced fabrication techniques and in using the same to develop bendable electronics, and advanced circuit simulation tools. Working alongside post-doctoral researchers, the student will integrate various process modules to demonstrate the concept.
As much of the work of the Glasgow team active in this area is strongly collaborative with leading global industrial and academic partners, the student will have the opportunity to showcase their talents to potential future employers.
The studentship is supported by the School, and it will cover tuition fees and provide a stipend of £13,726 per annum for 3.5 years.
How to apply
Application for this scholarship is made by using the online system at the following link for admission as a postgraduate research student to the admission team in the Recruitment and International Office:
It should be noted that this application is to gain admission to our PGR programme with the decision on this being based on your academic achievements.
The James Watt Scholarship Scheme is a competitive PhD Scholarship which requires the submission of an additional application subsequent to academic admission. More information can be found at http://www.gla.ac.uk/schools/engineering/phdopportunities/
For an informal discussion or for further information on this project, potential applicants are encouraged to contact: Dr Ravinder Dahiya ([Email Address Removed])
Closing date – 31 March 2014
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