MRes Structural Analysis of an Electronics Chassis and PCBs for Launcher Vehicle

Project Objectives
Establish structural limits of an electronics chassis aboard launcher vehicle under environment acceleration loads.

Identify Points of Failure (POF) and propose recommendations for redesign of electronics chassis/PCBs to meet acceleration load requirements.

Methodology proposed
Develop FEA models of the electronics chassis and PCBs including:

• Modal analysis.
• Steinberg studies to predict the operational life of electronic equipment, based on the component type exposed to shock and
vibration.
• Random vibration Acceleration Spectral Density (ASD) analysis.
• Non-Linear Shock Response Spectrum (SRS) analysis.
• Quasi-static acceleration analysis.
• Bolt studies to ECSS-E-HB-32-23A
• Damage Tolerance and Fatigue Control studies (ESACRACK).

Expected outcomes: (e.g. deliverables & strategic impacts)
• Verified FEA models as outlined above in methodology.
• Parametric FEA models used for sensitivity studies offering design solutions for sustaining this environment.

Research Core / Group
EngCORE http://www.engcore.ie